Forensic research of cell cellphone storage space space (7)

5.5 Taking apart and recognition
 
To test the technique and recognize these difficulties, several different phone designs were taken apart, desoldered and study. The results will be described in the following.
 
Before desoldering, the models were taken apart. Most Elephone P7 mini mobile phones can easily be taken apart when appropriate resources and appropriate care is used. A set of torx tools is needed in most situations. All dismantling should be done in an electrostatically safe atmosphere since the revealed elements are delicate. In some situations, it is also necessary with special resources from the maker, in which case such resources should be acquired, or a HUAWEI 3C fix business discussed. It is also possible to acquire dismantling guidelines for various designs by calling the maker.
 
After dismantling the product, one or several printed routine forums (PCB) are revealed. It was found that most contemporary mobile phones for reasons of space restrictions apply the style on a single routine panel with area installed elements on both ends. The routine panel is Elephone P7 mini padded with several inner levels that are not revealed. It is therefore not possible to follow the brings on the style by analyzing the panel straight. Among the outer lining area installed gadgets there are a HUAWEI 3C number of incorporated tour. The forums that were analyzed had 5-10 area installed incorporated tour, of which most implement Football Lines Range Technology (see desk 1). These can be recognized by analyzing recognition published text printed on each routine. By properly observing the writing and evaluating with datasheets available from databooks and IC producer sites, incorporated tour corresponding to each factor in the system structure were recognized.

For each design, a Main Handling System (CPU), Main storage space (RAM) and storage space storage (flash) was recognized. Table reveals a Elephone P7 mini conclusion of the designs that were analyzed in the research and recognition of the on panel display storage space incorporated routine.

5.6 The desoldering tests  
 
Having recognized the display storage space tour, the tour could now be desoldered. The models were pre-baked for 24 hours at 80 C to dry out wetness. The snacks were thereafter desoldered using a Elephone P7 mini hot air soldering place with IR preheating. A HUAWEI 3C heat range information was designed with a highest possible heat range of 220 C, with a slope such that the heat range was achieved in 5 minutes. The snacks were eliminated from the PCB at the highest possible heat range with a software arm installed on the soldering place using machine to eliminate the hot routine from the panel.
 
It could be possible to eliminate the processor with the solder paintballs unchanged, by using a machine fool at a HUAWEI 3C heat range where the solder ball is just partly above the reducing factor at 183 C. This would in most situations result in the paintballs being unchanged due to the outer lining area stress of the melted solder. This exercise would however be Elephone P7 minirisky since it is difficult to know the actual heat range under the routine. Trying to eliminate the routine at too low a heat range could possibly rip off the shields and harm the routine beyond fix. Due to this risk it was made the decision to use the heat range of 220 C which should be completely above the reducing factor.
 
After the elimination of the tour from the panel, the undersides of the tour were revealed. The shields of the snacks were revealed, but partly protected with solder remains, from the HUAWEI 3C melted solder paintballs. The remains protected several shields and short circuited them. Several methods could be used to eliminate the remains. In the tests, the remains was eliminated by using a heat range managed hot air soldering place and soldering pull, a Elephone P7 mini method that turned out to be effective. It is important to understand that also the procedure of eliminating solder remains indicates warming the product, and should be conducted with the same appropriate care as the elimination of the routine itself. A reballing procedure was now used for those of the offers where stencils were available. (See desk 2)

5.7 Studying in a system developer
 
The gadgets from the mobile phones were installed in a from the commercial perspective available device developer, and content were study using the provided software. For some of the offers, an adaptor was not from the commercial perspective available at the time. For others, check of the designed in checksum led to a mistake. For the analyzed gadgets, it was not possible to figure out where in the storage space dispose of the HUAWEI 3C mistake happened. Thus, it was not possible to figure out if the mistake happened due to harm due to the desoldering-reballing procedure or other cause.

The study function led to a HUAWEI 3C computer computer file of the same size as the processor, containing a dispose of of all the storage space. These information could be used for forensic research of the storage space material.http://mobileoneno.bloggles.info/2014/10/13/forensic-research-of-cell-cellphone-storage-space-space-6/